IPR Statements

Foxconn Interconnect Technology
Given the recent developments and introduction of new IP to the committee, Foxconn Interconnect Technology has searched its own extensive patent portfolio and discovered at least two patents, US Patent Nos. 8,353,707 and 8,292,669, which includes their respective foreign counterparts, that we believe contain one or more necessary claims directed toward features of the QSFP-DD interconnect design.  Foxconn will be happy to grant a license to these patents under RAND terms to any company that requests such a license.

Molex IPR Statement
Molex hereby provides notice that it believes it has several patents that include one or more necessary claims directed toward features of the QSFP-DD connector design. These patents include US Pat. Nos. 7,303,438; 7,448,897 and USRE43427 on the plug side (which would cover both active optical modules and passive electric plug connectors) as well as their foreign counterparts. Molex has further patent applications directed toward the internal construction of the receptacle side that may end up having one or more necessary claims. Molex hereby agrees that if any of above patents and/or patent applications (or any other patents Molex owns) have necessary claims then Molex will grant a license on reasonable and non-discriminatory terms to companies requesting such a license. Please note that Molex reserves the right to increase the cost for a licensee that refuses to take a license and forces Molex to use legal action in order to enforce Molex’s rights.

Senko IPR Statement
Pursuant to Section 9 of the Agreement and to avoid any misunderstanding, Senko reviewed its granted patents, and pending patent applications. Senko discloses that it has pending patent applications and granted patents that may have essential claims to aspects of the QSFP-DD interconnect design covering Senko’s connector or fiber optic receiver technology for Senko’s SN™ and CS® family. For SENKO’s CS® family, Senko believes U.S. Pat. No. 10,185,100 has essential claims. Senko will be happy to answer any questions about these applications as they arise, and reserves the right to provide further and more detailed notifications pursuant to the Agreement as necessary.

TE Connectivity IPR Statement
Given the latest rev 4.0 of the QSFP-DD specification dated September 18, 2018, TE is reconfirming the substance of its previous IP disclosure statements that:
TE believes the patent family having US patent 6517382 (and having US Patents 7074082, and 6524134) and the patent family having US patent 6749448 include essential claims for the QSFP-DD published draft mechanical specification. Further, TE has a patent family having US patent 7070446 including claims which could be applicable (although not essential) to one possible construction of the 2×1 cage/connector; and a patent family having US patent 6816376 including claims believed to be relevant to an optional feature of (although not essential to) the QSFP-DD published draft mechanical specification.

US Conec IPR Statement
US Conec hereby discloses that it has pending patent applications that may include essential claims directed toward duplex optical connector plugs specified in QSFP-DD. US Conec hereby declares that it will license under RAND terms pursuant to section 8 of the QSFP-DD Multi Source Agreement any essential claims of the above applications or other US Conec owned patents.